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机床用途与性能特征
1.该机床主要用于2-8寸LED蓝宝石等硬脆材料高速高精度多片切割加工。
2.该设备具有高钢性工作台;收放线传动结构简介可靠;张力控制采用伺服电机控制;配有断线报警装置。
3.该设备在计算机的控制下,金属线从放线轮、导线轮到切割轮、收线轮由伺服电机驱动,同步顺、逆转高速运行。
4.工作台速度变化、张力变化、切割液温度变化在切割过程中数据保存格式管理。
5.电气控制采用西门子总线控制技术;切割液温度、流量采用精确控制。
6.机床具有切片切口损失小、精度高、表面质量高、效率高的特点,可满足不同切割加工工艺要求;设备操作简单,保养方便。
Main features of the machine
1. The machine is mainly used 2—8 inch LED sapphire and other fragile materials with high speed and precision cutting.
2. It’s equipped with high rigidity table. Wire transmission is simple and reliable with alarm disconnected; Tension is controlled by servo motor.
3. Under the control of the computer, metal lines is driven by servo motors from actinomyces and guide wire round to cutting and turn wire round in the same direction or not with high speed operation.
4. The dates of worktable speed changes, tension changes, cutting fluid temperature when cutting are preserved.
5. Electric control from SIEMENS technology; incision fluid temperature and flow are controlled accurately.
6. Cut-chips have loss of less and they have high accuracy as well as high efficiency, satisfying different slicing techniques. Easy operation and maintained conveniently. |
设备技术参数 Specification
最大工作尺寸(直径)Max.dimension(φ) |
Φ8 inch |
工件最大长度Max.length |
300mm |
切割线直径Wire diameter |
0.25mm或根据要求而定 or special order |
切割线长度Wire length |
最长达 40km (max.) |
切割线速度 Peripheral speed |
可编程设定,最大达 15m/s |
正向和反向切割(自动反向)加速度最大达2.5m/s2 |
C.w. &c.c.w.; Cutting acceleration 2.5m/s2(max.) |
切割线张紧力 Wire tension |
15~40N |
进给速度 Feed rate |
0.1-2 mm/min,可编程设定 |
升降行程 Table vertical stroke |
最大 280mm |
控制装置 Control device |
西门子系统 SIEMENS system |
导轮驱动电机 Guide roll driving motor |
55Kw |
切割线供给/回收电机 Wire motor |
8Kw |
排线电机 Wire winding motor |
0.82Kw |
工作台升降电机 Table up/down motor |
0.88Kw |
张力控制电机 Tension control motor |
2.51Kw |
切割液泵电机 pump motor |
4Kw |
机床外形尺寸(长×宽×高)overall dimension |
2800×1650×2875mm |
机床重量 Total weight |
6000kg |
总功率 Power capacity |
80Kw |
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1、销售总监1名:
大专以上学历,在太阳能行业或相近机械行业销售管理工作经验,具有大中型企业2年以上销售经理或相同职位工作经验;...
2、销售主管3名:
大学专科以上学历,市场营销、机械类专业;从事机械销售1年以上,熟悉太阳能硅片加工设备或机械设备市场开发;..... |
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