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| 机床用途与性能特征 |
1、本机床为单晶硅滚圆专用机床；
2、机床采用外圆磨床布局形式，双磨头，金刚石和纤维平行砂轮；
3、机床床身、砂轮架、进给拖板均为铸件，刚性好，抗震性好；
4、机床进给、送料均采用平、V形导轨+滚珠丝杠+伺服电机；
5、头架、尾架采用特制四爪自定心夹具，夹具自定心精度高，操作简易(12″夹具另外选配）；
6、头架转速采用变频电机，无极调速；
7、单晶硅外圆表面的磨削纹路方向垂直于轴线与线切片机的加工方向一致，使其在切片过程中与四周圆弧不会产生裂纹；
8、电气系统采用进口三菱系列CPU。 |
| Main features of the machine: |
1. It's used for monocrystalline silicon rounding.
2. The layout of equipment is similar to that of cylindrical grinder. Dual electric spindle can be used. Diamond and fibrous wheel are also available.
3. The bed and grinding wheelhead as well as feed slide are also made of casting irons, featuring high rigidity and good anti-shock performance.
4. The machine feed is performed by driving the servo motor though the flat & V type guideway and ball screw.
5. The special four-jaw fixture is mounted on the headstock and tailstock featuring high self-centering accuracy（12matching fixture another）.
6. The headstock is driven by the freq. conversion motor is stepless speed.
7. The direction of grinding lines for monocrystalline silicon O.D. surface, which is perpendicular to axis, is same with the machining direction of wire saw, thus preventing cracking during slicing.
8. The imported MITSUBISHI CPU can be used in the electrical system. |
| 设备技术参数 Technical Specifications |
| 切削单晶硅大直径(Max. cutting diameter of monocrystalline silicon） |
Φ6〞～ 12〞 |
切削单晶硅大长度
(Max. cutting length of monocrystalline silicon） |
1000mm |
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1、销售总监1名：
大专以上学历，在太阳能行业或相近机械行业销售管理工作经验，具有大中型企业2年以上销售经理或相同职位工作经验；...
2、销售主管3名：
大学专科以上学历，市场营销、机械类专业；从事机械销售1年以上，熟悉太阳能硅片加工设备或机械设备市场开发；.....
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