机床用途与性能特征
1、本机床为单晶硅坯料切割专用设备，适用于单晶硅坯料的锯段，广泛应用于太阳 能电力和半导体工业等行业。
2、本机床床身、带轮座、送料、进给拖板均为铸铁构件，质量较重，刚度大，抗震性好。
3、选用优质金刚石锯带，锯割效率高，锯缝小，成品率高。
4、装夹单晶硅坯料工件，自动对中，方便准确。
5、进给、送料机构均采用直线导轨加滚珠丝杆结构，由伺服电机驱动，工件移动精 确可靠。
6、锯带轮电机采用变频调速，技术成熟，性能稳定。
7、机床控制用计算机程序设定，操作用触摸屏显示器，整个切削过程高效精确，降 低工人劳动强度，提高生产效率。
Usage & Application
1.This machine are specinally designed for monocrystalline silicon blank sawing which is widely applied in the solar energy electrical power and semi-conductor industry, etc.
2.The bed, band saw wheel shoe , loading and feed slide are also made of casting irons, featuring high rigidity and good anti-shock performance.
3.The high quality diamond band saw is adopted, which features high sawing & cutting efficiency, small sawing kerf and high rate of final products.
4. Clamping monocrystalline silicon blank with self centering is accurate and convenient.
5. The feeding and loading mechanism are path driven by the servo motor through the linear guideway and ball screw;the workpiece movement features more accurate and reliable.
6.Band saw is driven by AC moter with frequency convertor.
7.The machine is constrolled througth the PC programming,which is operated via touch screen to achive high efficiency process period and reducing the labor intensity as well as improving the productivity.
技术规格参数Technical data
切削单硅最大直径：(Max diameter of poly crystal silicon to becut)
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切削单晶硅最小厚度： (Min thickness of poly crystal silicon to be cut)
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锯带轮直径：(Band saw wleel dia)
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切削进给速度：(Cutting feed rate)
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微机控制，触
摸屏操作
(Micn computer control,touch-screen operation)
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工件最大切缝宽度: (Max saw seam width)
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锯带轮电机功率：(Band saw wleel motor power) |
2.2KW |
进给拖板最大行程： (Max stroke of feed slide)
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进料拖板最大行程： (Max stroke of feed slide) |
250 mm |
总功率：(Main power) |
6 KW |
总质量：(Weight) |
≈2500kg |
外形尺寸：(Overall dimension) |
1340X1980X1610 |
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