机床用途与性能特征
1、采用三菱公司的两轴联动数控系统，液晶显示。
2、工作台纵向移动及砂轮横向移动采用伺服电机+滚珠丝杠拖动。
3、本机床用于磨削太阳能行业单晶硅棒料，自动磨削快、工效高、操作简便、占地小。
4、采用外圆磨床布局形式，用金刚石平行砂轮，周边磨削单晶硅棒料外圆。
5、单晶硅外圆表面的磨削纹路方向垂直于轴线与线切片机的加工方向一致，使其在切片过程中与四周圆弧不会产生裂纹。
6、头架、尾架采用特制四爪自定心夹具，其夹具自定心精度高，操作简易。
7、头架、电机采用无级变频调速。
Main usage & characteristics
1. Mitsubishi CNC two-axis linkage system is adopted LCD screen.
2. The longitudinal movement of work table and transversal movement of grinding wheel is driven servo motors through ball-screw.
3. This equipment is used for grinding the monocyrstalline silicon bar with the features of quick grinding high efficiency,convenient
operation and with small floor space.
4. The layout of equipment is similar to that of cylindrical grinder. The diamond wheel is used for periphercl grinding the O.D. of the
monocyrstalline silicon bar.
5. The direction of grinding lines of the O.D. surface of the momocyrstalline silicon , which is perpendicular to axis, is the same as
machining direction of wire saw so as to prevent cracking while slicing.
6. The special four-jaw self centering chuck fixture is mounted on the headstock and tailstock, featuring high self-centering accuracy and
operation.
7. The headstock is driven by motor in stepless speed variation.
|
