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机床用途与性能特征
1、本机床用于太阳能行业单晶、多晶硅材料长方体的平面磨削加工,表面镜面抛光循环磨削功能,对原来硅锭的平
面垂直度起到修整功能,确保硅锭四面及棱边的损伤层有效的去除。
2、控制系统采用日本三菱系统。
3、采用机械方式自动对中心磨削、自动压紧,定位准确,固定可靠;磨削表面光洁度高。
4、砂轮进给采用三菱伺服电机驱动滚珠丝杠,具有很高定位精度,以保证获得两平面间的尺寸误差。
5、机床所有电气元器件均采用三菱、施耐德等国际国内知名品牌产品,保证机床控制系统稳定可靠。
Main usage & characteristics
1. It can be used to perform surface grinding and surface specular polishing grinding for monocrystalline and
polycrystalline silicon cuboids in the solar energy industry, thus providing good plane perpendicularity and
ensuring removal of the damaged laminate for four edges of silicon ingot.
2. MITSUBISHI servo motor system can be adopted.
3. Automatic centering device is also provided with the features of automatic clamping the silicon workpiece
and accurate positioning as well as high surface roughness.
4. The wheel feed is driven by driving the MITSUBISHI servo motor through the ball screw with high positioning
accuracy, thus providing high parallelism due to smaller size deviation between two planes.
5. MITSUBISHI、SCHEIDER electric components are used for ensuring reliable and stable operation of control
system.
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技术规格参数Technical Specifications |
加工后的公差及表面粗糙度 |
Tolerance & surface roughness after grinding |
两平面平行度
Parallelism between two planes planes |
0.01mm |
垂直度 Squareness |
0.02mm |
尺寸误差 Size variation |
0.02mm |
粗糙度Roughness |
Ra0.2m |
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工件规格 workpiece spec. |
125×125/156×156mm |
工件长度 workpiece length |
max500mm |
砂轮主轴数 the number of grinding wheel spindle |
2个 |
砂轮尺寸 grinding wheel size |
Ф200×Ф70×Ф190mm |
切削(研磨)速度 Cutting speed |
0.01--15m/min |
端面砂轮最小进给量 Min feed amount of endface wheel |
1um |
砂轮线速度 Wheel peripheral speed |
35m/s |
总功率 Main power |
3kw |
机床外形尺寸(长X宽X高) Overall dimension |
2000X1950X1350mm |
机床重量 Total weight |
3000kg |
冷却水接口 coolant fitting |
R1/4〞,25L/min |
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产品在江西赛维、常州光伏等企业投产运行 |
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磨面示意图 |
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1、销售总监1名:
大专以上学历,在太阳能行业或相近机械行业销售管理工作经验,具有大中型企业2年以上销售经理或相同职位工作经验;...
2、销售主管3名:
大学专科以上学历,市场营销、机械类专业;从事机械销售1年以上,熟悉太阳能硅片加工设备或机械设备市场开发;..... |
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