机床用途与性能特征
1、该设备主要适用于3″~8″太阳能行业硅棒及半导体材料硅棒、硅锭等硬脆材料的高速高精度切断加工。
2、该设备床身、带轮、进给拖板均为铸件,具有刚性好,抗震性好;机床进给、送料均采用直线导轨+滚珠丝杠+伺服电
机结构。
3、一次装夹,多次切割,确保切割断面的平行度,减少装夹时间,降低工人劳动强度,提高生产效率;切割效率高,可
满足不同切割加工工艺的要求。
4、锯带由油缸自动张紧,张紧力任意可调;选用优质金刚石锯带确保高效率,小锯缝,高成品率;最新锯带夹持机
构,确保锯带工作时不发生剧烈抖动;设备操作简单,保养方便。
Main usage & characteristics
1. It's mainly used for high speed procision material cutting process of solar industry silicon bar and slicing silicon bar and ingot with
diameter from 3 to 8 inches.
2. The bed, band saw wheel and feed slide are made of casting irons to feature of high rigidity and good anti-shock performance.
The feeding and loading process mechanism is driven by the servo motor through the linear guideway and ball screw.
3. Once clamping mult-cutting craft used to ensure cutting surface parallelism and to save the clamping time, reduce labor intensity
and achieve high productivity.
4. Band saw tensioning can be controlled by the oil cylinder with its randomly adjustable fastening force. The high-quality diamond
band saw is adopted, thus providing high efficiency and small sawing kerf as well as high yield. Band saw clamping mechanism
is also adopted. It can be operated easily and maintained conveniently.
技术规格参数Technical data
加工能力Machining capacity |
|
工件最大尺寸 Max. work dimension
(宽×高×长) |
Ф220×2000mm |
最大可切断工件尺寸Max.cutting dimension one time |
890mm |
带锯规格 Band saw spec |
|
长度 Length |
6100mm |
宽 Width |
38mm |
刃口厚度 Cutting-edge thickness |
1.0mm |
进给速度Feed rate |
25~300mm/min |
快进速度 Fast approach rate |
2000mm/min |
送给速度loading rate |
25~300mm/min |
快进速度 Fast opproach rate |
2000mm/min |
控制装置 Control system |
进口三菱Q系列CPU MITSUBISHI Series Q CPU |
带锯电机 Band saw motor |
7.5Kw |
进给电机 Feeding motor |
0.8 Kw |
送进电机 Loading motor |
2.0 Kw |
带速 Band saw speed |
1300m/min |
带锯张紧 Band saw tension |
500Kg~2000Kg,任意可调
(randomly adjusting) |
带轮尺寸 Band saw wheel size |
Ф915mm |
|
|
机床外形尺寸(长×宽×高)
Overall dimension (L×W×H)
|
|
|