机床用途与性能特征
1、该设备主要适用于5″～8″半导体材料硅锭等硬脆材料的高速倒角磨削加工。
2、该设备床身、工作台进给拖板均为铸件，具有刚性好，抗震性好；机床进给采用直线导轨+滚珠丝杠+伺服电机结构。
3、工件自动压紧，采用四磨头同时对工件的四个角进行倒角，减少装夹时间，降低工人劳动强度，提高生产效率；
采用金刚石砂轮。
4、可选配自动对中装置；设备操作简单，保养方便。
Main usage & characteristics
1. It's mainly used for slicing silicon ingot with diameter from 5 to 8 inches.
2. The bed and table feed slide are cast irons with the features of high rigidity and good anti-shock performance. The
machine feed is driven by the servo motor through the guideway and ball-screw.
3. Workpiece is pessei antomaticlly ，four wheel spindles are used to perform chamfering on four edges of workpiece
so as to reduce the labor intensity, save loading/unloading time and improve productivity.
4. The diamond wheel is used Automatic centering device is optional.This machine is easy to operated and maintain.
技术规格参数Technical Specifications
| 加工能力 Machining capacity |
|
工件最大尺寸（宽X高)
Max. work dimension (W×H) |
156×156/210×210mm |
工件最大长度
Max. length of work |
500mm |
| 进给速度 Feed rate |
25～300mm/min |
| 快进速度 Fast advance rate |
2000mm/min |
| 砂轮速度 Wheel speed |
7100mm/min，变频调速 freq. convertor |
| 控制装置 Control device |
进口三菱系列CPU
MITSUBISHI CPU |
| 砂轮电机 Wheel motor |
1.5 Kw |
| 进给电机 Feed motor |
3.5 Kw |
| 冷却水接口 coolant fitting |
R1/4〞，25L/min |
机床外形尺寸（长×宽×高）
Overall dimension (L×W×H) |
2200×1700×1800mm |
| 机床净重 Machine net weight |
4000kg |
|
